Published on 22 January 2013
TWI has conducted a major feasibility study into the use of adhesives instead of solder for surface mount technology in the electronics industry.
Adhesive bonding technology for the electronics industry has advanced rapidly in recent years. The introduction of conducting adhesives with improved properties and the development of more sophisticated dispensing and component placement techniques makes adhesives a potentially attractive alternative to solder.
The primary benefits of adopting adhesives as a method of surface mount attachment include:
- reduction in processing and materials cost
- fluxless assembly
- low temperature fabrication
- simpler rework
- high density interconnection
The topics covered in the project included: dispensing techniques; adhesive selection; mechanical, electrical and thermal performance; reliability and non-destructive testing.
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